Solder Alloy 301 vs. C17300 Copper
Solder alloy 301 belongs to the otherwise unclassified metals classification, while C17300 copper belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.
For each property being compared, the top bar is solder alloy 301 and the bottom bar is C17300 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 40 | |
| 120 |
| Elongation at Break, % | 51 | |
| 3.0 to 23 |
| Poisson's Ratio | 0.34 | |
| 0.33 |
| Shear Modulus, GPa | 15 | |
| 45 |
| Tensile Strength: Ultimate (UTS), MPa | 55 | |
| 500 to 1380 |
| Tensile Strength: Yield (Proof), MPa | 49 | |
| 160 to 1200 |
Thermal Properties
| Latent Heat of Fusion, J/g | 55 | |
| 230 |
| Melting Completion (Liquidus), °C | 140 | |
| 980 |
| Melting Onset (Solidus), °C | 140 | |
| 870 |
| Specific Heat Capacity, J/kg-K | 160 | |
| 380 |
| Thermal Conductivity, W/m-K | 19 | |
| 110 |
| Thermal Expansion, µm/m-K | 14 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 4.7 | |
| 22 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 4.9 | |
| 23 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.7 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 13 | |
| 9.4 |
| Embodied Energy, MJ/kg | 210 | |
| 150 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 27 | |
| 40 to 88 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 30 | |
| 110 to 5410 |
| Stiffness to Weight: Axial, points | 2.5 | |
| 7.6 |
| Stiffness to Weight: Bending, points | 13 | |
| 19 |
| Strength to Weight: Axial, points | 1.8 | |
| 16 to 44 |
| Strength to Weight: Bending, points | 3.7 | |
| 16 to 31 |
| Thermal Diffusivity, mm2/s | 13 | |
| 32 |
| Thermal Shock Resistance, points | 7.2 | |
| 17 to 48 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.2 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Beryllium (Be), % | 0 | |
| 1.8 to 2.0 |
| Bismuth (Bi), % | 56.5 to 59 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.050 | |
| 95.5 to 97.8 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.4 |
| Lead (Pb), % | 0 to 0.070 | |
| 0.2 to 0.6 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0.2 to 0.6 |
| Silicon (Si), % | 0 | |
| 0 to 0.2 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Tin (Sn), % | 41 to 43 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.5 |