Solder Alloy 301 vs. C97800 Nickel Silver
Solder alloy 301 belongs to the otherwise unclassified metals classification, while C97800 nickel silver belongs to the copper alloys. There are 25 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.
For each property being compared, the top bar is solder alloy 301 and the bottom bar is C97800 nickel silver.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 40 | |
| 130 |
| Elongation at Break, % | 51 | |
| 10 |
| Poisson's Ratio | 0.34 | |
| 0.33 |
| Shear Modulus, GPa | 15 | |
| 48 |
| Tensile Strength: Ultimate (UTS), MPa | 55 | |
| 370 |
| Tensile Strength: Yield (Proof), MPa | 49 | |
| 170 |
Thermal Properties
| Latent Heat of Fusion, J/g | 55 | |
| 220 |
| Melting Completion (Liquidus), °C | 140 | |
| 1180 |
| Melting Onset (Solidus), °C | 140 | |
| 1140 |
| Specific Heat Capacity, J/kg-K | 160 | |
| 390 |
| Thermal Conductivity, W/m-K | 19 | |
| 25 |
| Thermal Expansion, µm/m-K | 14 | |
| 16 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 4.7 | |
| 4.0 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 4.9 | |
| 4.1 |
Otherwise Unclassified Properties
| Density, g/cm3 | 8.7 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 13 | |
| 5.1 |
| Embodied Energy, MJ/kg | 210 | |
| 76 |
Common Calculations
| Resilience: Ultimate (Unit Rupture Work), MJ/m3 | 27 | |
| 31 |
| Resilience: Unit (Modulus of Resilience), kJ/m3 | 30 | |
| 120 |
| Stiffness to Weight: Axial, points | 2.5 | |
| 8.1 |
| Stiffness to Weight: Bending, points | 13 | |
| 19 |
| Strength to Weight: Axial, points | 1.8 | |
| 12 |
| Strength to Weight: Bending, points | 3.7 | |
| 13 |
| Thermal Diffusivity, mm2/s | 13 | |
| 7.3 |
| Thermal Shock Resistance, points | 7.2 | |
| 13 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.0050 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 to 0.2 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 56.5 to 59 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.050 | |
| 64 to 67 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 1.5 |
| Lead (Pb), % | 0 to 0.070 | |
| 1.0 to 2.5 |
| Nickel (Ni), % | 0 to 0.010 | |
| 24 to 27 |
| Phosphorus (P), % | 0 | |
| 0 to 0.050 |
| Silicon (Si), % | 0 | |
| 0 to 0.15 |
| Silver (Ag), % | 0 to 0.1 | |
| 0 |
| Sulfur (S), % | 0 | |
| 0 to 0.080 |
| Tin (Sn), % | 41 to 43 | |
| 4.0 to 5.5 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 1.0 to 4.0 |
| Residuals, % | 0 | |
| 0 to 0.4 |