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Solder Alloy 401 vs. C19010 Copper

Solder alloy 401 belongs to the otherwise unclassified metals classification, while C19010 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 401 and the bottom bar is C19010 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 50
120
Elongation at Break, % 21
2.4 to 22
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 29
330 to 640

Thermal Properties

Latent Heat of Fusion, J/g 60
210
Melting Completion (Liquidus), °C 230
1060
Melting Onset (Solidus), °C 230
1010
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 66
260
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
48 to 63
Electrical Conductivity: Equal Weight (Specific), % IACS 17
48 to 63

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
2.7
Embodied Energy, MJ/kg 250
42
Embodied Water, L/kg 1200
310

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.3
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.1
10 to 20
Strength to Weight: Bending, points 2.9
12 to 18
Thermal Diffusivity, mm2/s 40
75
Thermal Shock Resistance, points 1.9
12 to 23

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
97.3 to 99.04
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0.8 to 1.8
Phosphorus (P), % 0
0.010 to 0.050
Silicon (Si), % 0
0.15 to 0.35
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 98.5 to 99.5
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.5