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Solder Alloy 501 vs. Solder Alloy 111

Both solder alloy 501 and solder alloy 111 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 50% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is solder alloy 111.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
14
Elastic (Young's, Tensile) Modulus, GPa 51
33
Elongation at Break, % 22
35
Poisson's Ratio 0.36
0.4
Shear Modulus, GPa 19
12
Tensile Strength: Ultimate (UTS), MPa 29
41

Thermal Properties

Latent Heat of Fusion, J/g 60
41
Melting Completion (Liquidus), °C 230
220
Melting Onset (Solidus), °C 220
180
Specific Heat Capacity, J/kg-K 220
180
Thermal Conductivity, W/m-K 67
48
Thermal Expansion, µm/m-K 22
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
11
Electrical Conductivity: Equal Weight (Specific), % IACS 17
11

Otherwise Unclassified Properties

Density, g/cm3 7.3
9.3
Embodied Carbon, kg CO2/kg material 15
9.4
Embodied Energy, MJ/kg 260
160
Embodied Water, L/kg 1390
830

Common Calculations

Stiffness to Weight: Axial, points 3.8
2.0
Stiffness to Weight: Bending, points 17
12
Strength to Weight: Axial, points 1.1
1.2
Strength to Weight: Bending, points 2.9
2.8
Thermal Diffusivity, mm2/s 41
29
Thermal Shock Resistance, points 1.9
3.5

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.2
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.060
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0.5 to 0.9
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
48.8 to 50.5
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0.2 to 0.4
0 to 0.1
Tin (Sn), % 98.3 to 99.3
49.5 to 50.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010