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Solder Alloy 501 vs. C14700 Copper

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C14700 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C14700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 22
9.1 to 35
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 29
240 to 320

Thermal Properties

Latent Heat of Fusion, J/g 60
210
Melting Completion (Liquidus), °C 230
1080
Melting Onset (Solidus), °C 220
1070
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 67
370
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
95
Electrical Conductivity: Equal Weight (Specific), % IACS 17
96

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
2.6
Embodied Energy, MJ/kg 260
41
Embodied Water, L/kg 1390
310

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.1
7.3 to 10
Strength to Weight: Bending, points 2.9
9.5 to 12
Thermal Diffusivity, mm2/s 41
110
Thermal Shock Resistance, points 1.9
8.4 to 12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
99.395 to 99.798
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.0020 to 0.0050
Silver (Ag), % 0.2 to 0.4
0
Sulfur (S), % 0
0.2 to 0.5
Tin (Sn), % 98.3 to 99.3
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.1