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Solder Alloy 501 vs. C19800 Copper

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C19800 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C19800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
110
Elongation at Break, % 22
9.0 to 12
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 29
430 to 550

Thermal Properties

Latent Heat of Fusion, J/g 60
210
Melting Completion (Liquidus), °C 230
1070
Melting Onset (Solidus), °C 220
1050
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 67
260
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
61
Electrical Conductivity: Equal Weight (Specific), % IACS 17
62

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Carbon, kg CO2/kg material 15
2.8
Embodied Energy, MJ/kg 260
43
Embodied Water, L/kg 1390
320

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 1.1
14 to 17
Strength to Weight: Bending, points 2.9
14 to 17
Thermal Diffusivity, mm2/s 41
75
Thermal Shock Resistance, points 1.9
15 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
95.7 to 99.47
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.020 to 0.5
Lead (Pb), % 0 to 0.070
0
Magnesium (Mg), % 0
0.1 to 1.0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0.010 to 0.1
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0.1 to 1.0
Zinc (Zn), % 0 to 0.0010
0.3 to 1.5
Residuals, % 0
0 to 0.2