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Solder Alloy 501 vs. C69430 Brass

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C69430 brass belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C69430 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
110
Elongation at Break, % 22
17
Poisson's Ratio 0.36
0.33
Shear Modulus, GPa 19
42
Tensile Strength: Ultimate (UTS), MPa 29
570

Thermal Properties

Latent Heat of Fusion, J/g 60
260
Melting Completion (Liquidus), °C 230
920
Melting Onset (Solidus), °C 220
820
Specific Heat Capacity, J/kg-K 220
410
Thermal Conductivity, W/m-K 67
26
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
6.2
Electrical Conductivity: Equal Weight (Specific), % IACS 17
6.7

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.3
Embodied Carbon, kg CO2/kg material 15
2.7
Embodied Energy, MJ/kg 260
44
Embodied Water, L/kg 1390
300

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.4
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.1
19
Strength to Weight: Bending, points 2.9
18
Thermal Diffusivity, mm2/s 41
7.7
Thermal Shock Resistance, points 1.9
20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0.030 to 0.060
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
80 to 83
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.2
Lead (Pb), % 0 to 0.070
0 to 0.3
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
3.5 to 4.5
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0
Zinc (Zn), % 0 to 0.0010
11.4 to 16.5
Residuals, % 0
0 to 0.5