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Solder Alloy 501 vs. C69700 Brass

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C69700 brass belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C69700 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
110
Elongation at Break, % 22
25
Poisson's Ratio 0.36
0.32
Shear Modulus, GPa 19
41
Tensile Strength: Ultimate (UTS), MPa 29
470

Thermal Properties

Latent Heat of Fusion, J/g 60
240
Melting Completion (Liquidus), °C 230
930
Melting Onset (Solidus), °C 220
880
Specific Heat Capacity, J/kg-K 220
400
Thermal Conductivity, W/m-K 67
43
Thermal Expansion, µm/m-K 22
19

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.3
Embodied Carbon, kg CO2/kg material 15
2.7
Embodied Energy, MJ/kg 260
44
Embodied Water, L/kg 1390
310

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.3
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.1
16
Strength to Weight: Bending, points 2.9
16
Thermal Diffusivity, mm2/s 41
13
Thermal Shock Resistance, points 1.9
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
75 to 80
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.2
Lead (Pb), % 0 to 0.070
0.5 to 1.5
Manganese (Mn), % 0
0 to 0.4
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
2.5 to 3.5
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0
Zinc (Zn), % 0 to 0.0010
13.9 to 22
Residuals, % 0
0 to 0.5