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Solder Alloy 501 vs. C78200 Nickel Silver

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C78200 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C78200 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
110
Elongation at Break, % 22
3.0 to 40
Poisson's Ratio 0.36
0.32
Shear Modulus, GPa 19
43
Tensile Strength: Ultimate (UTS), MPa 29
370 to 630

Thermal Properties

Latent Heat of Fusion, J/g 60
190
Melting Completion (Liquidus), °C 230
1000
Melting Onset (Solidus), °C 220
970
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 67
48
Thermal Expansion, µm/m-K 22
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
11
Electrical Conductivity: Equal Weight (Specific), % IACS 17
12

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.4
Embodied Carbon, kg CO2/kg material 15
3.3
Embodied Energy, MJ/kg 260
52
Embodied Water, L/kg 1390
310

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.4
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.1
12 to 21
Strength to Weight: Bending, points 2.9
14 to 19
Thermal Diffusivity, mm2/s 41
15
Thermal Shock Resistance, points 1.9
12 to 21

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
63 to 67
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.35
Lead (Pb), % 0 to 0.070
1.5 to 2.5
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
7.0 to 9.0
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0
Zinc (Zn), % 0 to 0.0010
20.2 to 28.5
Residuals, % 0
0 to 0.5