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Solder Alloy 501 vs. C85400 Brass

Solder alloy 501 belongs to the otherwise unclassified metals classification, while C85400 brass belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 501 and the bottom bar is C85400 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
55
Elastic (Young's, Tensile) Modulus, GPa 51
100
Elongation at Break, % 22
23
Poisson's Ratio 0.36
0.32
Shear Modulus, GPa 19
40
Tensile Strength: Ultimate (UTS), MPa 29
220

Thermal Properties

Latent Heat of Fusion, J/g 60
180
Melting Completion (Liquidus), °C 230
940
Melting Onset (Solidus), °C 220
940
Specific Heat Capacity, J/kg-K 220
380
Thermal Conductivity, W/m-K 67
89
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
20
Electrical Conductivity: Equal Weight (Specific), % IACS 17
22

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.3
Embodied Carbon, kg CO2/kg material 15
2.8
Embodied Energy, MJ/kg 260
46
Embodied Water, L/kg 1390
330

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.0
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 1.1
7.5
Strength to Weight: Bending, points 2.9
9.9
Thermal Diffusivity, mm2/s 41
28
Thermal Shock Resistance, points 1.9
7.6

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.35
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.060
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0.5 to 0.9
65 to 70
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.7
Lead (Pb), % 0 to 0.070
1.5 to 3.8
Nickel (Ni), % 0 to 0.010
0 to 1.0
Silicon (Si), % 0
0 to 0.050
Silver (Ag), % 0.2 to 0.4
0
Tin (Sn), % 98.3 to 99.3
0.5 to 1.5
Zinc (Zn), % 0 to 0.0010
24 to 32
Residuals, % 0
0 to 1.1