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Solder Alloy 503 vs. CC380H Copper-nickel

Solder alloy 503 belongs to the otherwise unclassified metals classification, while CC380H copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is CC380H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
120
Elongation at Break, % 30
26
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
47
Tensile Strength: Ultimate (UTS), MPa 57
310

Thermal Properties

Latent Heat of Fusion, J/g 69
220
Melting Completion (Liquidus), °C 380
1130
Melting Onset (Solidus), °C 220
1080
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 61
46
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
11
Electrical Conductivity: Equal Weight (Specific), % IACS 17
11

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 16
3.8
Embodied Energy, MJ/kg 270
58

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.8
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
9.8
Strength to Weight: Bending, points 4.4
12
Thermal Diffusivity, mm2/s 35
13
Thermal Shock Resistance, points 3.5
11

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
84.5 to 89
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.0 to 1.8
Lead (Pb), % 0 to 0.070
0 to 0.030
Manganese (Mn), % 0
1.0 to 1.5
Nickel (Ni), % 0 to 0.010
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Silicon (Si), % 0
0 to 0.1
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0 to 0.5