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Solder Alloy 503 vs. C10100 Copper

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C10100 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C10100 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
120
Elongation at Break, % 30
1.5 to 50
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 57
220 to 410

Thermal Properties

Latent Heat of Fusion, J/g 69
210
Melting Completion (Liquidus), °C 380
1080
Melting Onset (Solidus), °C 220
1080
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 61
390
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
100
Electrical Conductivity: Equal Weight (Specific), % IACS 17
100

Otherwise Unclassified Properties

Density, g/cm3 7.5
9.0
Embodied Carbon, kg CO2/kg material 16
2.6
Embodied Energy, MJ/kg 270
41

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.8 to 13
Strength to Weight: Bending, points 4.4
9.0 to 14
Thermal Diffusivity, mm2/s 35
110
Thermal Shock Resistance, points 3.5
7.8 to 15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
99.99 to 100
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.0010
Nickel (Ni), % 0 to 0.010
0
Oxygen (O), % 0
0 to 0.00050
Phosphorus (P), % 0
0 to 0.00030
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0 to 0.00010