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Solder Alloy 503 vs. C18900 Copper

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C18900 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C18900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
120
Elongation at Break, % 30
14 to 48
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 57
260 to 500

Thermal Properties

Latent Heat of Fusion, J/g 69
210
Melting Completion (Liquidus), °C 380
1080
Melting Onset (Solidus), °C 220
1020
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 61
130
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
30
Electrical Conductivity: Equal Weight (Specific), % IACS 17
30

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 16
2.7
Embodied Energy, MJ/kg 270
42

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
8.2 to 16
Strength to Weight: Bending, points 4.4
10 to 16
Thermal Diffusivity, mm2/s 35
38
Thermal Shock Resistance, points 3.5
9.3 to 18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
97.7 to 99.15
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.020
Manganese (Mn), % 0
0.1 to 0.3
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
0 to 0.050
Silicon (Si), % 0
0.15 to 0.4
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0.6 to 0.9
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5