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Solder Alloy 503 vs. C55180 Copper

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C55180 copper belongs to the copper alloys. There are 20 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C55180 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
110
Elongation at Break, % 30
20
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
41
Tensile Strength: Ultimate (UTS), MPa 57
200

Thermal Properties

Latent Heat of Fusion, J/g 69
200
Melting Completion (Liquidus), °C 380
920
Melting Onset (Solidus), °C 220
710
Specific Heat Capacity, J/kg-K 230
400
Thermal Conductivity, W/m-K 61
200
Thermal Expansion, µm/m-K 22
17

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.6
Embodied Carbon, kg CO2/kg material 16
2.5
Embodied Energy, MJ/kg 270
39

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.1
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.4
Strength to Weight: Bending, points 4.4
8.8
Thermal Diffusivity, mm2/s 35
56
Thermal Shock Resistance, points 3.5
7.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
94.7 to 95.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
4.8 to 5.2
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15