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Solder Alloy 503 vs. C55281 Copper

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C55281 copper belongs to the copper alloys. There are 17 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C55281 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
110
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
40
Tensile Strength: Ultimate (UTS), MPa 57
190

Thermal Properties

Latent Heat of Fusion, J/g 69
190
Melting Completion (Liquidus), °C 380
810
Melting Onset (Solidus), °C 220
640
Specific Heat Capacity, J/kg-K 230
400
Thermal Expansion, µm/m-K 22
16

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.7
Embodied Carbon, kg CO2/kg material 16
7.0
Embodied Energy, MJ/kg 270
110

Common Calculations

Stiffness to Weight: Axial, points 4.1
6.9
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.1
Strength to Weight: Bending, points 4.4
8.5
Thermal Shock Resistance, points 3.5
7.7

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
88.5 to 89.4
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
5.8 to 6.2
Silver (Ag), % 1.8 to 2.2
4.8 to 5.2
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.15