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Solder Alloy 503 vs. C70400 Copper-nickel

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C70400 copper-nickel belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C70400 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
120
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 20
45
Tensile Strength: Ultimate (UTS), MPa 57
300 to 310

Thermal Properties

Latent Heat of Fusion, J/g 69
210
Melting Completion (Liquidus), °C 380
1120
Melting Onset (Solidus), °C 220
1060
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 61
64
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
14
Electrical Conductivity: Equal Weight (Specific), % IACS 17
14

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 16
3.0
Embodied Energy, MJ/kg 270
47

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.5
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
9.3 to 9.8
Strength to Weight: Bending, points 4.4
11 to 12
Thermal Diffusivity, mm2/s 35
18
Thermal Shock Resistance, points 3.5
10 to 11

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 5.5 to 6.5
89.8 to 93.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
1.3 to 1.7
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0.3 to 0.8
Nickel (Ni), % 0 to 0.010
4.8 to 6.2
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.5