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Solder Alloy 503 vs. C71580 Copper-nickel

Solder alloy 503 belongs to the otherwise unclassified metals classification, while C71580 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 503 and the bottom bar is C71580 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 54
140
Elongation at Break, % 30
40
Poisson's Ratio 0.36
0.33
Shear Modulus, GPa 20
51
Tensile Strength: Ultimate (UTS), MPa 57
330

Thermal Properties

Latent Heat of Fusion, J/g 69
230
Melting Completion (Liquidus), °C 380
1180
Melting Onset (Solidus), °C 220
1120
Specific Heat Capacity, J/kg-K 230
400
Thermal Conductivity, W/m-K 61
39
Thermal Expansion, µm/m-K 22
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
4.7
Electrical Conductivity: Equal Weight (Specific), % IACS 17
4.7

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 16
5.1
Embodied Energy, MJ/kg 270
74

Common Calculations

Stiffness to Weight: Axial, points 4.1
8.5
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
10
Strength to Weight: Bending, points 4.4
12
Thermal Diffusivity, mm2/s 35
11
Thermal Shock Resistance, points 3.5
11

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.080
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.070
Copper (Cu), % 5.5 to 6.5
65.5 to 71
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 0.3
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 1.8 to 2.2
0
Tin (Sn), % 90.8 to 92.7
0
Zinc (Zn), % 0 to 0.0010
0 to 0.050
Residuals, % 0
0 to 0.5