Solder Alloy 503 vs. C96700 Copper
Solder alloy 503 belongs to the otherwise unclassified metals classification, while C96700 copper belongs to the copper alloys. There are 20 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is solder alloy 503 and the bottom bar is C96700 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 54 | |
| 140 |
| Elongation at Break, % | 30 | |
| 10 |
| Poisson's Ratio | 0.36 | |
| 0.33 |
| Shear Modulus, GPa | 20 | |
| 53 |
| Tensile Strength: Ultimate (UTS), MPa | 57 | |
| 1210 |
Thermal Properties
| Latent Heat of Fusion, J/g | 69 | |
| 250 |
| Melting Completion (Liquidus), °C | 380 | |
| 1170 |
| Melting Onset (Solidus), °C | 220 | |
| 1110 |
| Specific Heat Capacity, J/kg-K | 230 | |
| 400 |
| Thermal Conductivity, W/m-K | 61 | |
| 30 |
| Thermal Expansion, µm/m-K | 22 | |
| 15 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.5 | |
| 8.8 |
| Embodied Carbon, kg CO2/kg material | 16 | |
| 9.5 |
| Embodied Energy, MJ/kg | 270 | |
| 140 |
Common Calculations
| Stiffness to Weight: Axial, points | 4.1 | |
| 8.9 |
| Stiffness to Weight: Bending, points | 17 | |
| 20 |
| Strength to Weight: Axial, points | 2.1 | |
| 38 |
| Strength to Weight: Bending, points | 4.4 | |
| 29 |
| Thermal Diffusivity, mm2/s | 35 | |
| 8.5 |
| Thermal Shock Resistance, points | 3.5 | |
| 40 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Beryllium (Be), % | 0 | |
| 1.1 to 1.2 |
| Bismuth (Bi), % | 0 to 0.080 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 5.5 to 6.5 | |
| 62.4 to 68.8 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0.4 to 1.0 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 | |
| 0.4 to 1.0 |
| Nickel (Ni), % | 0 to 0.010 | |
| 29 to 33 |
| Silicon (Si), % | 0 | |
| 0 to 0.15 |
| Silver (Ag), % | 1.8 to 2.2 | |
| 0 |
| Tin (Sn), % | 90.8 to 92.7 | |
| 0 |
| Titanium (Ti), % | 0 | |
| 0.15 to 0.35 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 |
| Zirconium (Zr), % | 0 | |
| 0.15 to 0.35 |
| Residuals, % | 0 | |
| 0 to 0.5 |