Solder Alloy 601 vs. ASTM B685 Alloy
Both solder alloy 601 and ASTM B685 alloy are otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.
For each property being compared, the top bar is solder alloy 601 and the bottom bar is ASTM B685 alloy.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 31 | |
120 |
Poisson's Ratio | 0.41 | |
0.37 |
Shear Modulus, GPa | 11 | |
43 |
Tensile Strength: Ultimate (UTS), MPa | 12 | |
660 to 1060 |
Thermal Properties
Latent Heat of Fusion, J/g | 43 | |
180 |
Melting Completion (Liquidus), °C | 120 | |
1230 |
Melting Onset (Solidus), °C | 120 | |
1200 |
Specific Heat Capacity, J/kg-K | 230 | |
300 |
Thermal Expansion, µm/m-K | 23 | |
14 |
Electrical Properties
Electrical Conductivity: Equal Volume, % IACS | 12 | |
5.0 |
Electrical Conductivity: Equal Weight (Specific), % IACS | 14 | |
4.1 |
Otherwise Unclassified Properties
Density, g/cm3 | 7.3 | |
11 |
Common Calculations
Stiffness to Weight: Axial, points | 2.3 | |
6.1 |
Stiffness to Weight: Bending, points | 14 | |
15 |
Strength to Weight: Axial, points | 0.45 | |
17 to 27 |
Strength to Weight: Bending, points | 1.6 | |
16 to 21 |
Thermal Shock Resistance, points | 1.2 | |
28 to 46 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 to 0.0050 |
Antimony (Sb), % | 0 to 0.1 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.1 | |
0 |
Cadmium (Cd), % | 0 to 0.0020 | |
0 to 0.050 |
Copper (Cu), % | 0 to 0.050 | |
39.5 to 40.5 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 51 to 52.5 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 to 0.050 |
Lead (Pb), % | 0 to 0.070 | |
0 to 0.030 |
Nickel (Ni), % | 0 to 0.010 | |
0 |
Palladium (Pd), % | 0 | |
59 to 60.5 |
Silver (Ag), % | 0 to 0.1 | |
0 to 0.1 |
Tin (Sn), % | 47.5 to 48.5 | |
0 |
Zinc (Zn), % | 0 to 0.0010 | |
0 to 0.060 |
Residuals, % | 0 | |
0 to 0.2 |