Solder Alloy 601 vs. EN 2.4680 Cast Nickel
Solder alloy 601 belongs to the otherwise unclassified metals classification, while EN 2.4680 cast nickel belongs to the nickel alloys. There are 19 material properties with values for both materials. Properties with values for just one material (11, in this case) are not shown.
For each property being compared, the top bar is solder alloy 601 and the bottom bar is EN 2.4680 cast nickel.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 31 | |
210 |
Elongation at Break, % | 83 | |
9.1 |
Poisson's Ratio | 0.41 | |
0.26 |
Shear Modulus, GPa | 11 | |
84 |
Tensile Strength: Ultimate (UTS), MPa | 12 | |
600 |
Thermal Properties
Latent Heat of Fusion, J/g | 43 | |
350 |
Melting Completion (Liquidus), °C | 120 | |
1360 |
Melting Onset (Solidus), °C | 120 | |
1320 |
Specific Heat Capacity, J/kg-K | 230 | |
480 |
Thermal Conductivity, W/m-K | 34 | |
14 |
Thermal Expansion, µm/m-K | 23 | |
15 |
Otherwise Unclassified Properties
Density, g/cm3 | 7.3 | |
8.0 |
Embodied Water, L/kg | 1330 | |
350 |
Common Calculations
Stiffness to Weight: Axial, points | 2.3 | |
15 |
Stiffness to Weight: Bending, points | 14 | |
25 |
Strength to Weight: Axial, points | 0.45 | |
21 |
Strength to Weight: Bending, points | 1.6 | |
20 |
Thermal Diffusivity, mm2/s | 20 | |
3.7 |
Thermal Shock Resistance, points | 1.2 | |
14 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 |
Antimony (Sb), % | 0 to 0.1 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.1 | |
0 |
Cadmium (Cd), % | 0 to 0.0020 | |
0 |
Carbon (C), % | 0 | |
0 to 0.1 |
Chromium (Cr), % | 0 | |
48 to 52 |
Copper (Cu), % | 0 to 0.050 | |
0 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 51 to 52.5 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 to 1.0 |
Lead (Pb), % | 0 to 0.070 | |
0 |
Manganese (Mn), % | 0 | |
0 to 0.5 |
Molybdenum (Mo), % | 0 | |
0 to 0.5 |
Nickel (Ni), % | 0 to 0.010 | |
42.9 to 51 |
Niobium (Nb), % | 0 | |
1.0 to 1.8 |
Nitrogen (N), % | 0 | |
0 to 0.16 |
Phosphorus (P), % | 0 | |
0 to 0.020 |
Silicon (Si), % | 0 | |
0 to 1.0 |
Silver (Ag), % | 0 to 0.1 | |
0 |
Sulfur (S), % | 0 | |
0 to 0.020 |
Tin (Sn), % | 47.5 to 48.5 | |
0 |
Zinc (Zn), % | 0 to 0.0010 | |
0 |