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Solder Alloy 601 vs. Solder Alloy 132

Both solder alloy 601 and solder alloy 132 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is solder alloy 132.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 31
37
Elongation at Break, % 83
43
Poisson's Ratio 0.41
0.39
Shear Modulus, GPa 11
13
Tensile Strength: Ultimate (UTS), MPa 12
52

Thermal Properties

Latent Heat of Fusion, J/g 43
45
Melting Completion (Liquidus), °C 120
190
Melting Onset (Solidus), °C 120
180
Specific Heat Capacity, J/kg-K 230
180
Thermal Conductivity, W/m-K 34
50
Thermal Expansion, µm/m-K 23
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
11
Electrical Conductivity: Equal Weight (Specific), % IACS 14
12

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.9
Embodied Water, L/kg 1330
910

Common Calculations

Stiffness to Weight: Axial, points 2.3
2.3
Stiffness to Weight: Bending, points 14
12
Strength to Weight: Axial, points 0.45
1.6
Strength to Weight: Bending, points 1.6
3.5
Thermal Diffusivity, mm2/s 20
30
Thermal Shock Resistance, points 1.2
4.1

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0.2 to 0.5
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 51 to 52.5
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
38.5 to 40.3
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 47.5 to 48.5
59.5 to 60.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010