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Solder Alloy 601 vs. Solder Alloy 151

Both solder alloy 601 and solder alloy 151 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 48% of their average alloy composition in common. There are 21 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is solder alloy 151.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 31
39
Elongation at Break, % 83
37
Poisson's Ratio 0.41
0.37
Shear Modulus, GPa 11
14
Tensile Strength: Ultimate (UTS), MPa 12
46

Thermal Properties

Latent Heat of Fusion, J/g 43
47
Melting Completion (Liquidus), °C 120
150
Melting Onset (Solidus), °C 120
150
Specific Heat Capacity, J/kg-K 230
190
Thermal Conductivity, W/m-K 34
44
Thermal Expansion, µm/m-K 23
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
10
Electrical Conductivity: Equal Weight (Specific), % IACS 14
10

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.8
Embodied Water, L/kg 1330
920

Common Calculations

Stiffness to Weight: Axial, points 2.3
2.5
Stiffness to Weight: Bending, points 14
13
Strength to Weight: Axial, points 0.45
1.4
Strength to Weight: Bending, points 1.6
3.2
Thermal Diffusivity, mm2/s 20
26
Thermal Shock Resistance, points 1.2
3.2

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.1
0 to 0.2
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.1
Cadmium (Cd), % 0 to 0.0020
17.5 to 18.5
Copper (Cu), % 0 to 0.050
0 to 0.080
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 51 to 52.5
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 0 to 0.070
30.3 to 33
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 47.5 to 48.5
49.5 to 50.5
Zinc (Zn), % 0 to 0.0010
0 to 0.0010