Solder Alloy 601 vs. C55280 Copper
Solder alloy 601 belongs to the otherwise unclassified metals classification, while C55280 copper belongs to the copper alloys. There are 15 material properties with values for both materials. Properties with values for just one material (11, in this case) are not shown.
For each property being compared, the top bar is solder alloy 601 and the bottom bar is C55280 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 31 | |
| 110 |
| Poisson's Ratio | 0.41 | |
| 0.34 |
| Shear Modulus, GPa | 11 | |
| 40 |
| Tensile Strength: Ultimate (UTS), MPa | 12 | |
| 180 |
Thermal Properties
| Latent Heat of Fusion, J/g | 43 | |
| 190 |
| Melting Completion (Liquidus), °C | 120 | |
| 790 |
| Melting Onset (Solidus), °C | 120 | |
| 640 |
| Specific Heat Capacity, J/kg-K | 230 | |
| 410 |
| Thermal Expansion, µm/m-K | 23 | |
| 16 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.3 | |
| 8.5 |
Common Calculations
| Stiffness to Weight: Axial, points | 2.3 | |
| 6.9 |
| Stiffness to Weight: Bending, points | 14 | |
| 19 |
| Strength to Weight: Axial, points | 0.45 | |
| 5.9 |
| Strength to Weight: Bending, points | 1.6 | |
| 8.3 |
| Thermal Shock Resistance, points | 1.2 | |
| 7.4 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Copper (Cu), % | 0 to 0.050 | |
| 90.5 to 91.4 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 51 to 52.5 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 |
| Phosphorus (P), % | 0 | |
| 6.8 to 7.2 |
| Silver (Ag), % | 0 to 0.1 | |
| 1.8 to 2.2 |
| Tin (Sn), % | 47.5 to 48.5 | |
| 0 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 |
| Residuals, % | 0 | |
| 0 to 0.15 |