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Solder Alloy 601 vs. C82800 Copper

Solder alloy 601 belongs to the otherwise unclassified metals classification, while C82800 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 601 and the bottom bar is C82800 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 31
120
Elongation at Break, % 83
1.0 to 20
Poisson's Ratio 0.41
0.33
Shear Modulus, GPa 11
46
Tensile Strength: Ultimate (UTS), MPa 12
670 to 1140

Thermal Properties

Latent Heat of Fusion, J/g 43
240
Melting Completion (Liquidus), °C 120
930
Melting Onset (Solidus), °C 120
890
Specific Heat Capacity, J/kg-K 230
390
Thermal Conductivity, W/m-K 34
120
Thermal Expansion, µm/m-K 23
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 12
18
Electrical Conductivity: Equal Weight (Specific), % IACS 14
19

Otherwise Unclassified Properties

Density, g/cm3 7.3
8.7
Embodied Water, L/kg 1330
310

Common Calculations

Stiffness to Weight: Axial, points 2.3
7.8
Stiffness to Weight: Bending, points 14
19
Strength to Weight: Axial, points 0.45
21 to 36
Strength to Weight: Bending, points 1.6
20 to 28
Thermal Diffusivity, mm2/s 20
36
Thermal Shock Resistance, points 1.2
23 to 39

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.15
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
2.5 to 2.9
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0 to 0.1
Cobalt (Co), % 0
0.15 to 0.7
Copper (Cu), % 0 to 0.050
94.6 to 97.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 51 to 52.5
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0 to 0.010
0 to 0.2
Silicon (Si), % 0
0.2 to 0.35
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 47.5 to 48.5
0 to 0.1
Titanium (Ti), % 0
0 to 0.12
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5