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Solder Alloy 701 vs. C82700 Copper

Solder alloy 701 belongs to the otherwise unclassified metals classification, while C82700 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 701 and the bottom bar is C82700 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 37
1.8
Poisson's Ratio 0.36
0.33
Shear Modulus, GPa 19
46
Tensile Strength: Ultimate (UTS), MPa 54
1200

Thermal Properties

Latent Heat of Fusion, J/g 61
240
Melting Completion (Liquidus), °C 230
950
Melting Onset (Solidus), °C 220
860
Specific Heat Capacity, J/kg-K 220
380
Thermal Conductivity, W/m-K 52
130
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 14
20
Electrical Conductivity: Equal Weight (Specific), % IACS 17
21

Otherwise Unclassified Properties

Density, g/cm3 7.4
8.7
Embodied Carbon, kg CO2/kg material 18
12
Embodied Energy, MJ/kg 300
180

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.8
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.0
38
Strength to Weight: Bending, points 4.3
29
Thermal Diffusivity, mm2/s 32
39
Thermal Shock Resistance, points 3.5
41

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.15
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
2.4 to 2.6
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0 to 0.090
Copper (Cu), % 0 to 0.050
94.6 to 96.7
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0 to 0.010
1.0 to 1.5
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 3.5 to 3.9
0
Tin (Sn), % 95.6 to 96.5
0 to 0.1
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5