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Solder Alloy 702 vs. ASTM B563 Pd-Ag-Cu

Both solder alloy 702 and ASTM B563 Pd-Ag-Cu are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 702 and the bottom bar is ASTM B563 Pd-Ag-Cu.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
100
Elongation at Break, % 21
7.0 to 17
Poisson's Ratio 0.36
0.37
Shear Modulus, GPa 19
37
Tensile Strength: Ultimate (UTS), MPa 53
760 to 1170

Thermal Properties

Latent Heat of Fusion, J/g 61
150
Melting Completion (Liquidus), °C 220
1180
Melting Onset (Solidus), °C 220
1030
Specific Heat Capacity, J/kg-K 220
260
Thermal Expansion, µm/m-K 22
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
5.6 to 6.7
Electrical Conductivity: Equal Weight (Specific), % IACS 18
4.6 to 5.5

Otherwise Unclassified Properties

Density, g/cm3 7.4
11

Common Calculations

Stiffness to Weight: Axial, points 3.8
5.2
Stiffness to Weight: Bending, points 17
14
Strength to Weight: Axial, points 2.0
19 to 30
Strength to Weight: Bending, points 4.2
17 to 22
Thermal Shock Resistance, points 3.4
39 to 61

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
15.5 to 16.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0.8 to 1.2
Palladium (Pd), % 0
43 to 45
Platinum (Pt), % 0
0.8 to 1.2
Silver (Ag), % 2.8 to 3.2
37 to 39
Tin (Sn), % 96.3 to 97.2
0
Zinc (Zn), % 0 to 0.0010
0
Residuals, % 0
0 to 0.4