Solder Alloy 702 vs. C82600 Copper
Solder alloy 702 belongs to the otherwise unclassified metals classification, while C82600 copper belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.
For each property being compared, the top bar is solder alloy 702 and the bottom bar is C82600 copper.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 51 | |
| 120 |
| Elongation at Break, % | 21 | |
| 1.0 to 20 |
| Poisson's Ratio | 0.36 | |
| 0.33 |
| Shear Modulus, GPa | 19 | |
| 46 |
| Tensile Strength: Ultimate (UTS), MPa | 53 | |
| 570 to 1140 |
Thermal Properties
| Latent Heat of Fusion, J/g | 61 | |
| 240 |
| Melting Completion (Liquidus), °C | 220 | |
| 950 |
| Melting Onset (Solidus), °C | 220 | |
| 860 |
| Specific Heat Capacity, J/kg-K | 220 | |
| 390 |
| Thermal Conductivity, W/m-K | 62 | |
| 130 |
| Thermal Expansion, µm/m-K | 22 | |
| 17 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 15 | |
| 19 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 18 | |
| 20 |
Otherwise Unclassified Properties
| Density, g/cm3 | 7.4 | |
| 8.7 |
| Embodied Carbon, kg CO2/kg material | 17 | |
| 11 |
| Embodied Energy, MJ/kg | 290 | |
| 180 |
Common Calculations
| Stiffness to Weight: Axial, points | 3.8 | |
| 7.8 |
| Stiffness to Weight: Bending, points | 17 | |
| 19 |
| Strength to Weight: Axial, points | 2.0 | |
| 18 to 36 |
| Strength to Weight: Bending, points | 4.2 | |
| 17 to 28 |
| Thermal Diffusivity, mm2/s | 38 | |
| 37 |
| Thermal Shock Resistance, points | 3.4 | |
| 19 to 39 |
Alloy Composition
| Aluminum (Al), % | 0 to 0.0010 | |
| 0 to 0.15 |
| Antimony (Sb), % | 0 to 0.1 | |
| 0 |
| Arsenic (As), % | 0 to 0.030 | |
| 0 |
| Beryllium (Be), % | 0 | |
| 2.3 to 2.6 |
| Bismuth (Bi), % | 0 to 0.1 | |
| 0 |
| Cadmium (Cd), % | 0 to 0.0020 | |
| 0 |
| Chromium (Cr), % | 0 | |
| 0 to 0.1 |
| Cobalt (Co), % | 0 | |
| 0.35 to 0.65 |
| Copper (Cu), % | 0 to 0.050 | |
| 94.9 to 97.2 |
| Gold (Au), % | 0 to 0.050 | |
| 0 |
| Indium (In), % | 0 to 0.1 | |
| 0 |
| Iron (Fe), % | 0 to 0.020 | |
| 0 to 0.25 |
| Lead (Pb), % | 0 to 0.070 | |
| 0 to 0.020 |
| Nickel (Ni), % | 0 to 0.010 | |
| 0 to 0.2 |
| Silicon (Si), % | 0 | |
| 0.2 to 0.35 |
| Silver (Ag), % | 2.8 to 3.2 | |
| 0 |
| Tin (Sn), % | 96.3 to 97.2 | |
| 0 to 0.1 |
| Titanium (Ti), % | 0 | |
| 0 to 0.12 |
| Zinc (Zn), % | 0 to 0.0010 | |
| 0 to 0.1 |
| Residuals, % | 0 | |
| 0 to 0.5 |