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Solder Alloy 704 vs. C72150 Copper-nickel

Solder alloy 704 belongs to the otherwise unclassified metals classification, while C72150 copper-nickel belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is C72150 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
99
Elastic (Young's, Tensile) Modulus, GPa 51
150
Elongation at Break, % 30
29
Poisson's Ratio 0.36
0.33
Shear Modulus, GPa 19
55
Tensile Strength: Ultimate (UTS), MPa 55
490

Thermal Properties

Latent Heat of Fusion, J/g 62
250
Melting Completion (Liquidus), °C 240
1210
Melting Onset (Solidus), °C 220
1250
Specific Heat Capacity, J/kg-K 220
410
Thermal Conductivity, W/m-K 50
22
Thermal Expansion, µm/m-K 22
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
3.5
Electrical Conductivity: Equal Weight (Specific), % IACS 15
3.6

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 19
6.1
Embodied Energy, MJ/kg 320
88

Common Calculations

Stiffness to Weight: Axial, points 3.8
9.1
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.1
15
Strength to Weight: Bending, points 4.3
15
Thermal Diffusivity, mm2/s 30
6.0
Thermal Shock Resistance, points 3.5
18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 0 to 0.050
52.5 to 57
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 0.050
Nickel (Ni), % 0 to 0.010
43 to 46
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 4.8 to 5.2
0
Tin (Sn), % 94.3 to 95.2
0
Zinc (Zn), % 0 to 0.0010
0 to 0.2
Residuals, % 0
0 to 0.5