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Solder Alloy 704 vs. C72200 Copper-nickel

Solder alloy 704 belongs to the otherwise unclassified metals classification, while C72200 copper-nickel belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is C72200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
130
Poisson's Ratio 0.36
0.33
Shear Modulus, GPa 19
48
Tensile Strength: Ultimate (UTS), MPa 55
350 to 580

Thermal Properties

Latent Heat of Fusion, J/g 62
220
Melting Completion (Liquidus), °C 240
1180
Melting Onset (Solidus), °C 220
1120
Specific Heat Capacity, J/kg-K 220
400
Thermal Conductivity, W/m-K 50
34
Thermal Expansion, µm/m-K 22
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
6.5
Electrical Conductivity: Equal Weight (Specific), % IACS 15
6.6

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 19
3.9
Embodied Energy, MJ/kg 320
59

Common Calculations

Stiffness to Weight: Axial, points 3.8
8.0
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
11 to 18
Strength to Weight: Bending, points 4.3
12 to 17
Thermal Diffusivity, mm2/s 30
9.6
Thermal Shock Resistance, points 3.5
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0.3 to 0.7
Copper (Cu), % 0 to 0.050
78.1 to 84.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.0
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
15 to 18
Silver (Ag), % 4.8 to 5.2
0
Tin (Sn), % 94.3 to 95.2
0
Zinc (Zn), % 0 to 0.0010
0 to 1.0
Residuals, % 0
0 to 0.2