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Solder Alloy 704 vs. C72900 Copper-nickel

Solder alloy 704 belongs to the otherwise unclassified metals classification, while C72900 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is C72900 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 30
6.0 to 20
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
45
Tensile Strength: Ultimate (UTS), MPa 55
870 to 1080

Thermal Properties

Latent Heat of Fusion, J/g 62
210
Melting Completion (Liquidus), °C 240
1120
Melting Onset (Solidus), °C 220
950
Specific Heat Capacity, J/kg-K 220
380
Thermal Conductivity, W/m-K 50
29
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
7.8
Electrical Conductivity: Equal Weight (Specific), % IACS 15
8.0

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.8
Embodied Carbon, kg CO2/kg material 19
4.6
Embodied Energy, MJ/kg 320
72

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
27 to 34
Strength to Weight: Bending, points 4.3
23 to 27
Thermal Diffusivity, mm2/s 30
8.6
Thermal Shock Resistance, points 3.5
31 to 38

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
74.1 to 78
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.5
Lead (Pb), % 0 to 0.070
0 to 0.020
Magnesium (Mg), % 0
0 to 0.15
Manganese (Mn), % 0
0 to 0.3
Nickel (Ni), % 0 to 0.010
14.5 to 15.5
Niobium (Nb), % 0
0 to 0.1
Silver (Ag), % 4.8 to 5.2
0
Tin (Sn), % 94.3 to 95.2
7.5 to 8.5
Zinc (Zn), % 0 to 0.0010
0 to 0.5
Residuals, % 0
0 to 0.3