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Solder Alloy 704 vs. C81500 Copper

Solder alloy 704 belongs to the otherwise unclassified metals classification, while C81500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 704 and the bottom bar is C81500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
110
Elastic (Young's, Tensile) Modulus, GPa 51
120
Elongation at Break, % 30
17
Poisson's Ratio 0.36
0.34
Shear Modulus, GPa 19
44
Tensile Strength: Ultimate (UTS), MPa 55
350

Thermal Properties

Latent Heat of Fusion, J/g 62
210
Melting Completion (Liquidus), °C 240
1090
Melting Onset (Solidus), °C 220
1080
Specific Heat Capacity, J/kg-K 220
390
Thermal Conductivity, W/m-K 50
320
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 13
82
Electrical Conductivity: Equal Weight (Specific), % IACS 15
83

Otherwise Unclassified Properties

Density, g/cm3 7.5
8.9
Embodied Carbon, kg CO2/kg material 19
2.6
Embodied Energy, MJ/kg 320
41

Common Calculations

Stiffness to Weight: Axial, points 3.8
7.3
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
11
Strength to Weight: Bending, points 4.3
12
Thermal Diffusivity, mm2/s 30
91
Thermal Shock Resistance, points 3.5
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Chromium (Cr), % 0
0.4 to 1.5
Copper (Cu), % 0 to 0.050
97.4 to 99.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.020
Nickel (Ni), % 0 to 0.010
0
Silicon (Si), % 0
0 to 0.15
Silver (Ag), % 4.8 to 5.2
0
Tin (Sn), % 94.3 to 95.2
0 to 0.1
Zinc (Zn), % 0 to 0.0010
0 to 0.1
Residuals, % 0
0 to 0.5