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Solder Alloy 801 vs. ASTM B596 Au-Cu

Both solder alloy 801 and ASTM B596 Au-Cu are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown. Please note that the two materials have significantly dissimilar densities. This means that additional care is required when interpreting the data, because some material properties are based on units of mass, while others are based on units of area or volume.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is ASTM B596 Au-Cu.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
100
Elongation at Break, % 33
4.3 to 17
Poisson's Ratio 0.35
0.41
Shear Modulus, GPa 20
36
Tensile Strength: Ultimate (UTS), MPa 55
450 to 620

Thermal Properties

Latent Heat of Fusion, J/g 64
77
Melting Completion (Liquidus), °C 200
1060
Melting Onset (Solidus), °C 200
930
Specific Heat Capacity, J/kg-K 240
150
Thermal Expansion, µm/m-K 22
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
14
Electrical Conductivity: Equal Weight (Specific), % IACS 19
6.7

Otherwise Unclassified Properties

Density, g/cm3 7.2
18

Common Calculations

Stiffness to Weight: Axial, points 4.1
3.1
Stiffness to Weight: Bending, points 17
8.5
Strength to Weight: Axial, points 2.1
6.8 to 9.4
Strength to Weight: Bending, points 4.4
7.1 to 8.8
Thermal Shock Resistance, points 3.3
22 to 30

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
9.0 to 11
Gold (Au), % 0 to 0.050
89 to 91
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.4