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Solder Alloy 801 vs. Commercially Pure Palladium

Both solder alloy 801 and commercially pure palladium are otherwise unclassified metals. There are 18 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is commercially pure palladium.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
1.1 to 11
Poisson's Ratio 0.35
0.39
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
200 to 380

Thermal Properties

Latent Heat of Fusion, J/g 64
160
Melting Completion (Liquidus), °C 200
1550
Melting Onset (Solidus), °C 200
1550
Specific Heat Capacity, J/kg-K 240
240
Thermal Expansion, µm/m-K 22
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
16
Electrical Conductivity: Equal Weight (Specific), % IACS 19
12

Otherwise Unclassified Properties

Density, g/cm3 7.2
12

Common Calculations

Stiffness to Weight: Axial, points 4.1
5.6
Stiffness to Weight: Bending, points 17
14
Strength to Weight: Axial, points 2.1
4.5 to 8.8
Strength to Weight: Bending, points 4.4
6.2 to 9.7
Thermal Shock Resistance, points 3.3
9.8 to 19

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
0
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Palladium (Pd), % 0
99.8 to 100
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.2