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Solder Alloy 801 vs. CC383H Copper-nickel

Solder alloy 801 belongs to the otherwise unclassified metals classification, while CC383H copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
130
Elastic (Young's, Tensile) Modulus, GPa 53
140
Elongation at Break, % 33
20
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
52
Tensile Strength: Ultimate (UTS), MPa 55
490

Thermal Properties

Latent Heat of Fusion, J/g 64
240
Melting Completion (Liquidus), °C 200
1180
Melting Onset (Solidus), °C 200
1130
Specific Heat Capacity, J/kg-K 240
410
Thermal Conductivity, W/m-K 61
29
Thermal Expansion, µm/m-K 22
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 19
5.3

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
5.7
Embodied Energy, MJ/kg 240
83
Embodied Water, L/kg 1140
280

Common Calculations

Stiffness to Weight: Axial, points 4.1
8.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
15
Strength to Weight: Bending, points 4.4
16
Thermal Diffusivity, mm2/s 36
8.1
Thermal Shock Resistance, points 3.3
17

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0 to 0.0020
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 0 to 0.050
64 to 69.1
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.5 to 1.5
Lead (Pb), % 0 to 0.070
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 0 to 0.010
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0
0.3 to 0.7
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0 to 0.5