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Solder Alloy 801 vs. CC751S Brass

Solder alloy 801 belongs to the otherwise unclassified metals classification, while CC751S brass belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is CC751S brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
130
Elastic (Young's, Tensile) Modulus, GPa 53
110
Elongation at Break, % 33
5.6
Poisson's Ratio 0.35
0.31
Shear Modulus, GPa 20
40
Tensile Strength: Ultimate (UTS), MPa 55
450

Thermal Properties

Latent Heat of Fusion, J/g 64
190
Melting Completion (Liquidus), °C 200
850
Melting Onset (Solidus), °C 200
810
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
110
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
25
Electrical Conductivity: Equal Weight (Specific), % IACS 19
28

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.1
Embodied Carbon, kg CO2/kg material 14
2.8
Embodied Energy, MJ/kg 240
46
Embodied Water, L/kg 1140
330

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
15
Strength to Weight: Bending, points 4.4
16
Thermal Diffusivity, mm2/s 36
35
Thermal Shock Resistance, points 3.3
15

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.1
Antimony (Sb), % 0 to 0.1
0 to 0.5
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
62.7 to 66
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.25 to 0.5
Lead (Pb), % 0 to 0.070
0.8 to 2.2
Manganese (Mn), % 0
0 to 0.15
Nickel (Ni), % 0 to 0.010
0 to 0.8
Silicon (Si), % 0
0.65 to 1.1
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0 to 0.8
Zinc (Zn), % 8.5 to 9.5
27.9 to 35.6