Solder Alloy 801 vs. Grade 366 Molybdenum
Both solder alloy 801 and grade 366 molybdenum are otherwise unclassified metals. There are 17 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.
For each property being compared, the top bar is solder alloy 801 and the bottom bar is grade 366 molybdenum.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 53 | |
300 |
Elongation at Break, % | 33 | |
2.2 |
Poisson's Ratio | 0.35 | |
0.3 |
Shear Modulus, GPa | 20 | |
120 |
Tensile Strength: Ultimate (UTS), MPa | 55 | |
580 |
Thermal Properties
Latent Heat of Fusion, J/g | 64 | |
310 |
Specific Heat Capacity, J/kg-K | 240 | |
210 |
Thermal Expansion, µm/m-K | 22 | |
7.6 |
Otherwise Unclassified Properties
Density, g/cm3 | 7.2 | |
12 |
Embodied Carbon, kg CO2/kg material | 14 | |
27 |
Embodied Energy, MJ/kg | 240 | |
340 |
Embodied Water, L/kg | 1140 | |
300 |
Common Calculations
Stiffness to Weight: Axial, points | 4.1 | |
14 |
Stiffness to Weight: Bending, points | 17 | |
18 |
Strength to Weight: Axial, points | 2.1 | |
13 |
Strength to Weight: Bending, points | 4.4 | |
13 |
Thermal Shock Resistance, points | 3.3 | |
18 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 |
Antimony (Sb), % | 0 to 0.1 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.1 | |
0 |
Cadmium (Cd), % | 0 to 0.0020 | |
0 |
Carbon (C), % | 0 | |
0 to 0.030 |
Copper (Cu), % | 0 to 0.050 | |
0 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 0 to 0.1 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 to 0.010 |
Lead (Pb), % | 0 to 0.070 | |
0 |
Molybdenum (Mo), % | 0 | |
66.9 to 73 |
Nickel (Ni), % | 0 to 0.010 | |
0 to 0.0020 |
Nitrogen (N), % | 0 | |
0 to 0.0020 |
Oxygen (O), % | 0 | |
0 to 0.0025 |
Silicon (Si), % | 0 | |
0 to 0.010 |
Silver (Ag), % | 0 to 0.1 | |
0 |
Tin (Sn), % | 89.9 to 91.5 | |
0 |
Tungsten (W), % | 0 | |
27 to 33 |
Zinc (Zn), % | 8.5 to 9.5 | |
0 |