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Solder Alloy 801 vs. Grade CU5MCuC Nickel

Solder alloy 801 belongs to the otherwise unclassified metals classification, while grade CU5MCuC nickel belongs to the nickel alloys. There are 19 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is grade CU5MCuC nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
200
Elongation at Break, % 33
22
Poisson's Ratio 0.35
0.28
Shear Modulus, GPa 20
77
Tensile Strength: Ultimate (UTS), MPa 55
580

Thermal Properties

Latent Heat of Fusion, J/g 64
310
Melting Completion (Liquidus), °C 200
1420
Melting Onset (Solidus), °C 200
1370
Specific Heat Capacity, J/kg-K 240
460
Thermal Expansion, µm/m-K 22
13

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.2
Embodied Carbon, kg CO2/kg material 14
7.7
Embodied Energy, MJ/kg 240
110
Embodied Water, L/kg 1140
230

Common Calculations

Stiffness to Weight: Axial, points 4.1
13
Stiffness to Weight: Bending, points 17
24
Strength to Weight: Axial, points 2.1
20
Strength to Weight: Bending, points 4.4
19
Thermal Shock Resistance, points 3.3
16

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.050
Chromium (Cr), % 0
19.5 to 23.5
Copper (Cu), % 0 to 0.050
1.5 to 3.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
22.2 to 37.9
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 1.0
Molybdenum (Mo), % 0
2.5 to 3.5
Nickel (Ni), % 0 to 0.010
38 to 44
Niobium (Nb), % 0
0.6 to 1.2
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 1.0
Silver (Ag), % 0 to 0.1
0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0