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Solder Alloy 801 vs. C10500 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C10500 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (10, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C10500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
2.8 to 51
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
220 to 400

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1080
Melting Onset (Solidus), °C 200
1080
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
390
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
100
Electrical Conductivity: Equal Weight (Specific), % IACS 19
100

Otherwise Unclassified Properties

Density, g/cm3 7.2
9.0
Embodied Carbon, kg CO2/kg material 14
2.6
Embodied Energy, MJ/kg 240
42
Embodied Water, L/kg 1140
350

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.8 to 12
Strength to Weight: Bending, points 4.4
9.1 to 14
Thermal Diffusivity, mm2/s 36
110
Thermal Shock Resistance, points 3.3
7.8 to 14

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
99.89 to 99.966
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Oxygen (O), % 0
0 to 0.0010
Silver (Ag), % 0 to 0.1
0.034 to 0.060
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.050