Solder Alloy 801 vs. C14180 Copper
Solder alloy 801 belongs to the otherwise unclassified metals classification, while C14180 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.
For each property being compared, the top bar is solder alloy 801 and the bottom bar is C14180 copper.
Metric UnitsUS Customary Units
Mechanical Properties
Elastic (Young's, Tensile) Modulus, GPa | 53 | |
120 |
Elongation at Break, % | 33 | |
15 |
Poisson's Ratio | 0.35 | |
0.34 |
Shear Modulus, GPa | 20 | |
43 |
Tensile Strength: Ultimate (UTS), MPa | 55 | |
210 |
Thermal Properties
Latent Heat of Fusion, J/g | 64 | |
210 |
Melting Completion (Liquidus), °C | 200 | |
1080 |
Melting Onset (Solidus), °C | 200 | |
1080 |
Specific Heat Capacity, J/kg-K | 240 | |
390 |
Thermal Conductivity, W/m-K | 61 | |
370 |
Thermal Expansion, µm/m-K | 22 | |
17 |
Otherwise Unclassified Properties
Density, g/cm3 | 7.2 | |
9.0 |
Embodied Carbon, kg CO2/kg material | 14 | |
2.6 |
Embodied Energy, MJ/kg | 240 | |
41 |
Embodied Water, L/kg | 1140 | |
310 |
Common Calculations
Stiffness to Weight: Axial, points | 4.1 | |
7.2 |
Stiffness to Weight: Bending, points | 17 | |
18 |
Strength to Weight: Axial, points | 2.1 | |
6.5 |
Strength to Weight: Bending, points | 4.4 | |
8.8 |
Thermal Diffusivity, mm2/s | 36 | |
110 |
Thermal Shock Resistance, points | 3.3 | |
7.4 |
Alloy Composition
Aluminum (Al), % | 0 to 0.0010 | |
0 to 0.010 |
Antimony (Sb), % | 0 to 0.1 | |
0 |
Arsenic (As), % | 0 to 0.030 | |
0 |
Bismuth (Bi), % | 0 to 0.1 | |
0 |
Cadmium (Cd), % | 0 to 0.0020 | |
0 |
Copper (Cu), % | 0 to 0.050 | |
99.9 to 100 |
Gold (Au), % | 0 to 0.050 | |
0 |
Indium (In), % | 0 to 0.1 | |
0 |
Iron (Fe), % | 0 to 0.020 | |
0 |
Lead (Pb), % | 0 to 0.070 | |
0 to 0.020 |
Nickel (Ni), % | 0 to 0.010 | |
0 |
Phosphorus (P), % | 0 | |
0 to 0.075 |
Silver (Ag), % | 0 to 0.1 | |
0 |
Tin (Sn), % | 89.9 to 91.5 | |
0 |
Zinc (Zn), % | 8.5 to 9.5 | |
0 |