MakeItFrom.com
Menu (ESC)

Solder Alloy 801 vs. C17200 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C17200 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C17200 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
1.1 to 37
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
45
Tensile Strength: Ultimate (UTS), MPa 55
480 to 1380

Thermal Properties

Latent Heat of Fusion, J/g 64
230
Melting Completion (Liquidus), °C 200
980
Melting Onset (Solidus), °C 200
870
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
110
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
22
Electrical Conductivity: Equal Weight (Specific), % IACS 19
23

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.8
Embodied Carbon, kg CO2/kg material 14
9.4
Embodied Energy, MJ/kg 240
150
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
15 to 44
Strength to Weight: Bending, points 4.4
16 to 31
Thermal Diffusivity, mm2/s 36
31
Thermal Shock Resistance, points 3.3
16 to 46

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.2
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Beryllium (Be), % 0
1.8 to 2.0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
96.1 to 98
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.4
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0.2 to 0.6
Silicon (Si), % 0
0 to 0.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.5