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Solder Alloy 801 vs. C19025 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C19025 copper belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C19025 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
8.0 to 17
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
480 to 620

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1080
Melting Onset (Solidus), °C 200
1020
Specific Heat Capacity, J/kg-K 240
380
Thermal Conductivity, W/m-K 61
160
Thermal Expansion, µm/m-K 22
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
40
Electrical Conductivity: Equal Weight (Specific), % IACS 19
40

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
2.8
Embodied Energy, MJ/kg 240
44
Embodied Water, L/kg 1140
320

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
15 to 19
Strength to Weight: Bending, points 4.4
15 to 18
Thermal Diffusivity, mm2/s 36
47
Thermal Shock Resistance, points 3.3
17 to 22

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
97.1 to 98.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0.8 to 1.2
Phosphorus (P), % 0
0.030 to 0.070
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0.7 to 1.1
Zinc (Zn), % 8.5 to 9.5
0 to 0.2
Residuals, % 0
0 to 0.3