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Solder Alloy 801 vs. C55180 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C55180 copper belongs to the copper alloys. There are 21 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C55180 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Elongation at Break, % 33
20
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
41
Tensile Strength: Ultimate (UTS), MPa 55
200

Thermal Properties

Latent Heat of Fusion, J/g 64
200
Melting Completion (Liquidus), °C 200
920
Melting Onset (Solidus), °C 200
710
Specific Heat Capacity, J/kg-K 240
400
Thermal Conductivity, W/m-K 61
200
Thermal Expansion, µm/m-K 22
17

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.6
Embodied Carbon, kg CO2/kg material 14
2.5
Embodied Energy, MJ/kg 240
39
Embodied Water, L/kg 1140
290

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.1
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
6.4
Strength to Weight: Bending, points 4.4
8.8
Thermal Diffusivity, mm2/s 36
56
Thermal Shock Resistance, points 3.3
7.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
94.7 to 95.2
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
4.8 to 5.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.15