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Solder Alloy 801 vs. C55284 Copper

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C55284 copper belongs to the copper alloys. There are 17 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C55284 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
100
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
38
Tensile Strength: Ultimate (UTS), MPa 55
180

Thermal Properties

Latent Heat of Fusion, J/g 64
180
Melting Completion (Liquidus), °C 200
800
Melting Onset (Solidus), °C 200
640
Specific Heat Capacity, J/kg-K 240
380
Thermal Expansion, µm/m-K 22
17

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
16
Embodied Energy, MJ/kg 240
260

Common Calculations

Stiffness to Weight: Axial, points 4.1
6.5
Stiffness to Weight: Bending, points 17
18
Strength to Weight: Axial, points 2.1
5.6
Strength to Weight: Bending, points 4.4
8.0
Thermal Shock Resistance, points 3.3
7.4

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
79.2 to 80.7
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0
Nickel (Ni), % 0 to 0.010
0
Phosphorus (P), % 0
4.8 to 5.2
Silver (Ag), % 0 to 0.1
14.5 to 15.5
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.15