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Solder Alloy 801 vs. C66200 Brass

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C66200 brass belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C66200 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Elongation at Break, % 33
8.0 to 15
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
42
Tensile Strength: Ultimate (UTS), MPa 55
450 to 520

Thermal Properties

Latent Heat of Fusion, J/g 64
200
Melting Completion (Liquidus), °C 200
1070
Melting Onset (Solidus), °C 200
1030
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
150
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
35
Electrical Conductivity: Equal Weight (Specific), % IACS 19
36

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.7
Embodied Carbon, kg CO2/kg material 14
2.7
Embodied Energy, MJ/kg 240
43
Embodied Water, L/kg 1140
320

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.2
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
14 to 17
Strength to Weight: Bending, points 4.4
15 to 16
Thermal Diffusivity, mm2/s 36
45
Thermal Shock Resistance, points 3.3
16 to 18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
86.6 to 91
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.050
Lead (Pb), % 0 to 0.070
0 to 0.050
Nickel (Ni), % 0 to 0.010
0.3 to 1.0
Phosphorus (P), % 0
0.050 to 0.2
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0.2 to 0.7
Zinc (Zn), % 8.5 to 9.5
6.5 to 12.9
Residuals, % 0
0 to 0.5