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Solder Alloy 801 vs. C70700 Copper-nickel

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C70700 copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C70700 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
73
Elastic (Young's, Tensile) Modulus, GPa 53
120
Elongation at Break, % 33
39
Poisson's Ratio 0.35
0.34
Shear Modulus, GPa 20
46
Tensile Strength: Ultimate (UTS), MPa 55
320

Thermal Properties

Latent Heat of Fusion, J/g 64
220
Melting Completion (Liquidus), °C 200
1120
Melting Onset (Solidus), °C 200
1060
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
59
Thermal Expansion, µm/m-K 22
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
11
Electrical Conductivity: Equal Weight (Specific), % IACS 19
12

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
3.4
Embodied Energy, MJ/kg 240
52
Embodied Water, L/kg 1140
300

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
10
Strength to Weight: Bending, points 4.4
12
Thermal Diffusivity, mm2/s 36
17
Thermal Shock Resistance, points 3.3
12

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
88.5 to 90.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.050
Lead (Pb), % 0 to 0.070
0
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
9.5 to 10.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0
Residuals, % 0
0 to 0.5