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Solder Alloy 801 vs. C71500 Copper-nickel

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C71500 copper-nickel belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C71500 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
140
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
52
Tensile Strength: Ultimate (UTS), MPa 55
380 to 620

Thermal Properties

Latent Heat of Fusion, J/g 64
230
Melting Completion (Liquidus), °C 200
1240
Melting Onset (Solidus), °C 200
1170
Specific Heat Capacity, J/kg-K 240
400
Thermal Conductivity, W/m-K 61
28
Thermal Expansion, µm/m-K 22
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
4.6
Electrical Conductivity: Equal Weight (Specific), % IACS 19
4.7

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
5.1
Embodied Energy, MJ/kg 240
74
Embodied Water, L/kg 1140
280

Common Calculations

Stiffness to Weight: Axial, points 4.1
8.6
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
12 to 19
Strength to Weight: Bending, points 4.4
13 to 18
Thermal Diffusivity, mm2/s 36
7.7
Thermal Shock Resistance, points 3.3
12 to 20

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63.5 to 70.6
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0.4 to 1.0
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 1.0
Nickel (Ni), % 0 to 0.010
29 to 33
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0 to 1.0
Residuals, % 0
0 to 0.5