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Solder Alloy 801 vs. C72150 Copper-nickel

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C72150 copper-nickel belongs to the copper alloys. There are 24 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C72150 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 22
99
Elastic (Young's, Tensile) Modulus, GPa 53
150
Elongation at Break, % 33
29
Poisson's Ratio 0.35
0.33
Shear Modulus, GPa 20
55
Tensile Strength: Ultimate (UTS), MPa 55
490

Thermal Properties

Latent Heat of Fusion, J/g 64
250
Melting Completion (Liquidus), °C 200
1210
Melting Onset (Solidus), °C 200
1250
Specific Heat Capacity, J/kg-K 240
410
Thermal Conductivity, W/m-K 61
22
Thermal Expansion, µm/m-K 22
14

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
3.5
Electrical Conductivity: Equal Weight (Specific), % IACS 19
3.6

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.9
Embodied Carbon, kg CO2/kg material 14
6.1
Embodied Energy, MJ/kg 240
88
Embodied Water, L/kg 1140
270

Common Calculations

Stiffness to Weight: Axial, points 4.1
9.1
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.1
15
Strength to Weight: Bending, points 4.4
15
Thermal Diffusivity, mm2/s 36
6.0
Thermal Shock Resistance, points 3.3
18

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 0 to 0.050
52.5 to 57
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.1
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 0.050
Nickel (Ni), % 0 to 0.010
43 to 46
Silicon (Si), % 0
0 to 0.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
0 to 0.2
Residuals, % 0
0 to 0.5