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Solder Alloy 801 vs. C75200 Nickel Silver

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C75200 nickel silver belongs to the copper alloys. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C75200 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
120
Poisson's Ratio 0.35
0.32
Shear Modulus, GPa 20
47
Tensile Strength: Ultimate (UTS), MPa 55
400 to 660

Thermal Properties

Latent Heat of Fusion, J/g 64
210
Melting Completion (Liquidus), °C 200
1110
Melting Onset (Solidus), °C 200
1070
Specific Heat Capacity, J/kg-K 240
400
Thermal Conductivity, W/m-K 61
33
Thermal Expansion, µm/m-K 22
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 19
6.3

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.5
Embodied Carbon, kg CO2/kg material 14
4.1
Embodied Energy, MJ/kg 240
62
Embodied Water, L/kg 1140
300

Common Calculations

Stiffness to Weight: Axial, points 4.1
8.0
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
13 to 21
Strength to Weight: Bending, points 4.4
14 to 20
Thermal Diffusivity, mm2/s 36
9.8
Thermal Shock Resistance, points 3.3
13 to 22

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63.5 to 66.5
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.25
Lead (Pb), % 0 to 0.070
0 to 0.050
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
16.5 to 19.5
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
12.7 to 20
Residuals, % 0
0 to 0.5