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Solder Alloy 801 vs. C77300 Nickel Silver

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C77300 nickel silver belongs to the copper alloys. There are 20 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C77300 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Poisson's Ratio 0.35
0.3
Shear Modulus, GPa 20
42
Tensile Strength: Ultimate (UTS), MPa 55
540

Thermal Properties

Latent Heat of Fusion, J/g 64
180
Melting Completion (Liquidus), °C 200
940
Melting Onset (Solidus), °C 200
920
Specific Heat Capacity, J/kg-K 240
390
Thermal Expansion, µm/m-K 22
20

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
5.5
Electrical Conductivity: Equal Weight (Specific), % IACS 19
6.3

Otherwise Unclassified Properties

Density, g/cm3 7.2
7.9
Embodied Carbon, kg CO2/kg material 14
3.5
Embodied Energy, MJ/kg 240
56
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.7
Stiffness to Weight: Bending, points 17
20
Strength to Weight: Axial, points 2.1
19
Strength to Weight: Bending, points 4.4
19
Thermal Shock Resistance, points 3.3
17

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.010
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
46 to 50
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0
Lead (Pb), % 0 to 0.070
0 to 0.050
Nickel (Ni), % 0 to 0.010
9.0 to 11
Phosphorus (P), % 0
0 to 0.25
Silicon (Si), % 0
0.040 to 0.25
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
37.9 to 45
Residuals, % 0
0 to 0.5