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Solder Alloy 801 vs. C78200 Nickel Silver

Solder alloy 801 belongs to the otherwise unclassified metals classification, while C78200 nickel silver belongs to the copper alloys. There are 23 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is solder alloy 801 and the bottom bar is C78200 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 53
110
Elongation at Break, % 33
3.0 to 40
Poisson's Ratio 0.35
0.32
Shear Modulus, GPa 20
43
Tensile Strength: Ultimate (UTS), MPa 55
370 to 630

Thermal Properties

Latent Heat of Fusion, J/g 64
190
Melting Completion (Liquidus), °C 200
1000
Melting Onset (Solidus), °C 200
970
Specific Heat Capacity, J/kg-K 240
390
Thermal Conductivity, W/m-K 61
48
Thermal Expansion, µm/m-K 22
19

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 15
11
Electrical Conductivity: Equal Weight (Specific), % IACS 19
12

Otherwise Unclassified Properties

Density, g/cm3 7.2
8.4
Embodied Carbon, kg CO2/kg material 14
3.3
Embodied Energy, MJ/kg 240
52
Embodied Water, L/kg 1140
310

Common Calculations

Stiffness to Weight: Axial, points 4.1
7.4
Stiffness to Weight: Bending, points 17
19
Strength to Weight: Axial, points 2.1
12 to 21
Strength to Weight: Bending, points 4.4
14 to 19
Thermal Diffusivity, mm2/s 36
15
Thermal Shock Resistance, points 3.3
12 to 21

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0
Antimony (Sb), % 0 to 0.1
0
Arsenic (As), % 0 to 0.030
0
Bismuth (Bi), % 0 to 0.1
0
Cadmium (Cd), % 0 to 0.0020
0
Copper (Cu), % 0 to 0.050
63 to 67
Gold (Au), % 0 to 0.050
0
Indium (In), % 0 to 0.1
0
Iron (Fe), % 0 to 0.020
0 to 0.35
Lead (Pb), % 0 to 0.070
1.5 to 2.5
Manganese (Mn), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.010
7.0 to 9.0
Silver (Ag), % 0 to 0.1
0
Tin (Sn), % 89.9 to 91.5
0
Zinc (Zn), % 8.5 to 9.5
20.2 to 28.5
Residuals, % 0
0 to 0.5